BGF124 Key Features
- ESD protection circuit and interface filter for SIM cards
- Reduced line capacitance of 12 pF maximum
- ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs
- Wafer level package with SnAgCu solder balls
- 400 µm solder ball pitch
- RoHS and WEEE pliant package