Infineon Technologies BGF125
BGF125 is an ESD protection and filtering circuit for SIM card interfaces. The wafer level package is a green lead-free and halogen-free package with a size of only 1.15 mm x 1.15 mm and a total height of 0.6 mm C2 A3 B3 C3 R1, 100 Ω R2, 47 Ω R3, 100 Ω Ext.| Part No. | BGF125 |
|---|---|
| Datasheet | BGF125 Download |
| Manufacturer |  Infineon Technologies |
| Description | SIM Card Interface Filter and ESD Protection |
| Buy | Stock & Price |
FEATURES
● ESD protection circuit and interface filter for SIM cards● Reduced line capacitance of 12 pF maximum
● ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs
● Wafer level package with SnAgCu solder balls
● 400 µm solder ball pitch
● RoHS and WEEE compliant package WLP-8-10-N-3D
DESCRIPTION
All external IOs are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. IOs A2 B1 C1 GND, B2 BGF125 _schematic.vsd Figure 1 Type BGF125 Table 1 Parameter Schematic Package WLP-8-10MAXIMUM RATINGS
Symbol Min. Values Typ. – – – – – – Max. 5 +85 +150 60 2 15 V °C °C mW kV kV 0 -40 -65 – -2 -15 Unit Note / Test Condition – – – Marking 25 Chip N0745 Voltage at all pins to GND Operating temperature range Storage temperature range Summed up input power for all pins Contact discharge at internal pins A3, B3, C3 VP TOP TSTG Pin VESD TS < 70 °C – – Electrostatic Discharge According to IEC61000-4-2 Contact discharge at external pins A...
