Infineon Technologies BGF124
BGF124 is an ESD protection and filtering circuit for SIM card and USB interfaces. The wafer level package is a green lead-free and halogen-free package with a size of only 1.15 mm x 1.55 mm and a total height of 0.6 mm D1 A1 B1 C1 R1, 100 Ω R2, 47 Ω R3, 100 Ω D2 D3 Ext .| Part No. | BGF124 |
|---|---|
| Datasheet | BGF124 Download |
| Manufacturer |  Infineon Technologies |
| Description | SIM Card Interface Filter and USB Interface |
| Buy | Stock & Price |
FEATURES
● ESD protection circuit and interface filter for SIM cards● Reduced line capacitance of 12 pF maximum
● ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs
● Wafer level package with SnAgCu solder balls
● 400 µm solder ball pitch
● RoHS and WEEE compliant package WLP-11-4-N
DESCRIPTION
All external IOs are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. IOs A3 B3 C3 GND, A2, C2 BGF124 _schematic.vsd Figure 1 Type BGF124 Table 1 Parameter Schematic Package WLP-11-4MAXIMUM RATINGS
Symbol Min. Values Typ. – – – – – – Max. 5 +85 +150 60 2 15 V °C °C mW kV kV 0 -40 -65 – -2 -15 Unit Note / Test Condition – – – Marking 24 Chip N0744 Voltage at all pins to GND Operating temperature range Storage temperature range Summed up input power for all pins Contact discharge at internal pins A1, B1, C1 VP TOP TSTG Pin VESD TS < 70 °C – – Electrostatic Discharge According to IEC61000-4-2 Contact discharge at external pins...
