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IPC022N03L3 Datasheet MOSFET

Manufacturer: Infineon

General Description

•N-channelenhancementmode •FordynamiccharacterizationrefertothedatasheetofIPD075N03LG •AQL0.65forvisualinspectionaccordingtofailurecatalogue •ElectrostaticDischargeSensitiveDeviceaccordingtoMIL-STD883C •Diebond:solderedorglued •Sawnonfoil •Backsidemetallization:NiVsystem •Frontsidemetallization:AlCusystem •Passivation:Nitride+Imide PowerMOSTransistorChip Table1KeyPerformanceParameters Parameter Value Unit V(BR)DSS RDS(on) Die size 30 7.51) 2.1 x 1.05 V mΩ mm2 Thickness 175 µm Drain Gate Source Type/OrderingCode IPC022N03L3 Package Chip Marking not defined RelatedLinks - 2ElectricalCharacteristicsonWaferLevel atTj=25°C,unlessotherwisespecified Table2 Parameter Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on- resistance Reverse diode forward on-voltage Internal gate resistance Avalanche energy, single pulse Symbol V(BR)DSS VGS(th) IDSS IGSS RDS(on) VSD RG EAS Min.

30 1 - Values Typ.

Max.

Overview

MOSFET MetalOxideSemiconductorFieldEffectTransistor BareDie OptiMOS™3PowerMOSTransistorChip IPC022N03L3 DataSheet Rev.2.