PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is follo.

The IRF6648PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET™ packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET™ package .

IRF6648

IRF6648PbF

IRF6641TR1PBF

IRF6641TRPBF

IRF6643TRPbF

IRF6644

IRF6644PbF

IRF6645

IRF6645PBF

IRF6645TRPBF

IRF6646

IRF6646PbF

IRF6646TRPbF