PG-LQFP-64-13 Description
P/PG-LQFP-64-4, -5, -13 Package Outline 1.6 MAX. per side 1 Foot Print Soldering Type: Reflow Soldering 0.5 12 1.35 11.45 0.5 0.29 0.29 11.45 Package Information 1.35 Published by Infineon Tec hnologies AG 7° MAX.
PG-LQFP-64-13 is Package Outline manufactured by Infineon .
P/PG-LQFP-64-4, -5, -13 Package Outline 1.6 MAX. per side 1 Foot Print Soldering Type: Reflow Soldering 0.5 12 1.35 11.45 0.5 0.29 0.29 11.45 Package Information 1.35 Published by Infineon Tec hnologies AG 7° MAX.