SIGC128T170R3 Datasheet | Infineon

.. IGBT Chip Features : - 1700V Trench + Field Stop technology - low turn-off losses - short tail current - positive temperature coefficient - easy paralleling This chip is used for: - power module Applications: - drives Chip Type SIGC128T170R3 ICn Die Size 11.33 x 11.33 mm2 Package sawn on foil Ordering Code Q67050A4189-A001 1700V 100A MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 11.33 x 11.33 8 x...