SIGC12T120 Datasheet | Infineon

.. IGBT Chip Features : - 1200V Trench & Field Stop technology - low turn-off losses - short tail current - positive temperature coefficient - easy paralleling This chip is used for: - power module Applications: - drives Chip Type SIGC12T120 VCE 1200V ICn 8A Die Size 3.54 x 3.5 mm2 Package sawn on foil Ordering Code Q67050A4102-A001 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 3.54 x 3.5 2.028 x 2.028...