SIGC32T120R3 Datasheet | Infineon

.. IGBT Chip Features : - 1200V Trench + Field Stop technology - low turn-off losses - short tail current - positive temperature coefficient - easy paralleling This chip is used for: - power module Applications: - drives Chip Type SIGC32T120R3 VCE 1200V ICn 25A Die Size 6.5 x 4.87 mm2 Package sawn on foil Ordering Code Q67050A4104-A001 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 6.5 x 4.87 3.4 x 4.992...