SIGC68T170R3
SIGC68T170R3 is IGBT manufactured by Infineon.
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IGBT Chip
Features
:
- 1700V Trench + Field Stop technology
- low turn-off losses
- short tail current
- positive temperature coefficient
- easy paralleling
This chip is used for:
- power module
Applications:
- drives
Chip Type SIGC68T170R3
VCE 1700V
ICn 50A
Die Size 8.23 x 8.25 mm2
Package sawn on foil
Ordering Code Q67050A4147-A001
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 8.23 x 8.25 4 x ( 2.94...
