28F008 Datasheet | Intel

3 Volt Advanced Boot Block Flash Memory 28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Preliminary Datasheet Product Features s Flexible Smart Voltage Technology - 2.7 V- 3.6 V Read/Program/Erase - 12 V VPP Fast Production Programming s 2.7 V or 1.65 V I/O Option - Reduces Overall System Power s High Performance - 2.7 V- 3.6 V: 70 ns Max Access Time s Optimized Block Sizes - Eight 8-KB Blocks for Data,Top or Bottom Locations - Up to One Hundred Twenty-Seven 64KB Blocks for Code s Block Locking - VCC-Level Control through WP# s Low Power Consumption - 9 m A Typical Read Current s Absolute Hardware-Protection - VPP = GND Option - VCC Lockout Voltage s Extended Temperature Operation - - 40 °C to +85 °C s Automated Program and Block Erase - Status Registers s Intel® Flash Data Integrator Software - Flash Memory Manager - System Interrupt Manager - Supports Parameter Storage, Streaming Data (e.g., Voice) s Extended Cycling Capability - Minimum 100,000 Block Erase Cycles Guaranteed s Automatic Power Savings Feature - Typical ICCS after Bus Inactivity s Standard Surface Mount Packaging - 48-Ball CSP Packages - 40- and 48-Lead TSOP Packages s Density and Footprint Upgradeable for mon package - 4-, 8-, 16-, 32- and 64-Mbit Densities s ETOX™ VII (0.18 µ) Flash Technology - 28F160/320/640B3x C - 4-, 8-, 16-, and 32-Mbit also exist on ETOX™ V (0.4µ) and/or ETOX ™ VI (0.25µ) Flash Technology s x8 not remended for new designs s 4-Mbit density not remended for new designs The 3 Volt Advanced Boot Block flash memory, manufactured on Intel’s latest 0.18 µm technology, represents a feature-rich solution at overall lower system cost. The 3 Volt Advanced Boot Block flash memory products in x16 will be available in 48-lead TSOP and 48-ball CSP packages. The x8 option of this product family will only be available in 40-lead TSOP and 48ball µBGA- packages. Additional information on this product family can be obtained by accessing Intel’s website at: http://.intel.co...