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Intel Corporation

RD38F1010C0ZTL0 Datasheet Preview

RD38F1010C0ZTL0 Datasheet

(RD38Fxxxx) Flash Memory

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U.com®
hMIeneette4ml orAyd(vCa3n)ced+ Boot Block FlashSCSP Family
.DataS Product Features
Datasheet
ww Flash Memory Plus SRAM
w — Reduces Memory Board Space
mRequired, Simplifying PCB Design
Complexity
oSCSP Technology
.c—Smallest Memory Subsystem Footprint
— Area : 8 x 10 mm for 16 Mbit (0.13 µm)
Flash + 2 Mbit or 4 Mbit SRAM
U— Area : 8 x 12 mm for 32 Mbit (0.13 µm)
t4Flash + 4 Mbit or 8 Mbit SRAM
— Height : 1.20 mm for 16 Mbit (0.13 µm)
Flash + 2 Mbit or 4 Mbit SRAM, and 32
eMbit (0.13um) Flash + 8 Mbit SRAM
e— Height : 1.40 mm for 32 Mbit (0.13 µm)
Flash + 4 Mbit SRAM
h— This Family also includes 0.25 µm, 0.18
µm, and 0.13 µm technologies
SAdvanced SRAM Technology
ta—70 ns Access Time
— Low Power Operation
a— Low Voltage Data Retention Mode
Intel® Flash Data Integrator (FDI)
Software
.D—Real-Time Data Storage and Code
Execution in the Same Memory Device
w— Full Flash File Manager Capability
Advanced+ Boot Block Flash Memory
—70 ns Access Time
—Instant, Individual Block Locking
—128 bit Protection Register
—12 V Production Programming
—Fast Program and Erase Suspend
—Extended Temperature –25 °C to +85 °C
Blocking Architecture
—Block Sizes for Code + Data Storage
—4-Kword Parameter Blocks
—64-Kbyte Main Blocks
—100,000 Erase Cycles per Block
Low Power Operation
—Asynchronous Read Current: 9 mA
(Flash)
—Standby Current: 7 µA (Flash)
—Automatic Power Saving Mode
Flash Technologies
—0.25 µm ETOX™ VI, 0.18 µm ETOX™
VII and 0.13 µm ETOX™ VIII Flash
Technologies
The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP)
wdevice delivers a feature-rich solution for low-power applications. The C3 SCSP memory device
incorporates flash memory and static RAM in one package with low voltage capability to
w omachieve the smallest system memory solution form-factor together with high-speed, low-power
.coperations. The C3 SCSP memory device offers a protection register and flexible block locking
to enable next generation security capability. Combined with the Intel® Flash Data Integrator
U(Intel® FDI) software, the C3 SCSP memory device provides a cost-effective, flexible, code plus
t4data storage solution.
.DataSheeOrder Number: 252636, Revision: 004
www 26 Aug 2005




Intel Corporation

RD38F1010C0ZTL0 Datasheet Preview

RD38F1010C0ZTL0 Datasheet

(RD38Fxxxx) Flash Memory

No Preview Available !

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS
AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO
FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the
presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by
estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The Intel® Advanced+ Boot Block Flash Memory (C3) may contain design defects or errors known as errata which may cause the product to deviate
from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
Intel, the Intel logo, Intel StrataFlash, and ETOX are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States
and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005, Intel Corporation. All rights reserved.
26 Aug 2005
2
Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family
Order Number: 252636, Revision: 004
Datasheet


Part Number RD38F1010C0ZTL0
Description (RD38Fxxxx) Flash Memory
Maker Intel Corporation
Total Page 30 Pages
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