RD38Fxxxxxx Datasheet | Intel Corporation

m o .c ® U Intel Advanced+ Boot Block Flash 4 t e Memory (C3) e hSCSP Family S a t Datasheet a .D Product Features w w w m o .c U 4 t e e h S a t a .D w w w - - - - Flash Memory Plus SRAM - Reduces Memory Board Space Required, Simplifying PCB Design plexity SCSP Technology - Smallest Memory Subsystem Footprint - Area : 8 x 10 mm for 16 Mbit (0.13 µm) Flash + 2 Mbit or 4 Mbit SRAM - Area : 8 x 12 mm for 32 Mbit (0.13 µm) Flash + 4 Mbit or 8 Mbit SRAM - Height : 1.20 mm for 16 Mbit (0.13 µm) Flash + 2 Mbit or 4 Mbit SRAM, and 32 Mbit (0.13um) Flash + 8 Mbit SRAM - Height : 1.40 mm for 32 Mbit (0.13 µm) Flash + 4 Mbit SRAM - This Family also includes 0.25 µm, 0.18 µm, and 0.13 µm...