RD38Fxxxxxx Overview
m o .c ® U Intel Advanced+ Boot Block Flash 4 t e Memory (C3) e hSCSP Family S a t Datasheet a .D Product.
RD38Fxxxxxx Key Features
- Reduces Memory Board Space Required, Simplifying PCB Design plexity SCSP Technology
- Smallest Memory Subsystem Footprint
- Area : 8 x 10 mm for 16 Mbit (0.13 µm) Flash + 2 Mbit or 4 Mbit SRAM
- Area : 8 x 12 mm for 32 Mbit (0.13 µm) Flash + 4 Mbit or 8 Mbit SRAM
- Height : 1.20 mm for 16 Mbit (0.13 µm) Flash + 2 Mbit or 4 Mbit SRAM, and 32 Mbit (0.13um) Flash + 8 Mbit SRAM
- Height : 1.40 mm for 32 Mbit (0.13 µm) Flash + 4 Mbit SRAM
- This Family also includes 0.25 µm, 0.18 µm, and 0.13 µm technologies Advanced SRAM Technology
- 70 ns Access Time
- Low Power Operation
- Low Voltage Data Retention Mode Intel® Flash Data Integrator (FDI) Software
