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IR05H40CSPTR - FlipKY

General Description

International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space.

Key Features

  • Ultra Low VF To Footprint Area.
  • Very Low Profile (.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Bulletin I0170J rev. D 05/06 www.DataSheet4U.com IR05H40CSPTR FlipKYTM 0.5 Amp 40 Volt Features • Ultra Low VF To Footprint Area • • • Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel Applications • Reverse Polarity Protection • • • • Current Steering Freewheeling Flyback Oring FlipKYTM Major Ratings and Characteristics Characteristics IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 μs sine VF TJ @ 0.5 Apk, TJ=125°C range IR05H40CSP 0.5 40 190 0.42 - 55 to 150 Units A V A V °C Description International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.