IR2103(S)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol
VB
VS
VHO
VCC
VLO
VIN
dVs/dt
PD
RthJA
TJ
TS
TL
Definition
High side floating absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Logic input voltage (HIN & LIN)
Allowable offset supply voltage transient
Package power dissipation @ TA ≤ +25°C
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
(8 Lead PDIP)
(8 Lead SOIC)
(8 Lead PDIP)
(8 Lead SOIC)
Min.
-0.3
VB - 25
VS - 0.3
-0.3
-0.3
-0.3
—
—
—
—
—
—
-55
—
Max.
625
VB + 0.3
VB + 0.3
25
VCC + 0.3
VCC + 0.3
50
1.0
0.625
125
200
150
150
300
Units
V
V/ns
W
°C/W
°C
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.
Symbol
VB
VS
VHO
VCC
VLO
VIN
TA
Definition
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Logic input voltage (HIN & LIN)
Ambient temperature
Min.
VS + 10
Note 1
VS
10
0
0
-40
Max.
VS + 20
600
VB
20
VCC
VCC
125
Units
V
°C
Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip
DT97-3 for more details).
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