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IRFHM9391TRPBF - Power MOSFET

Description

Dimension design to accommodate the component width Dimension design to accommodate the co

Features

  • Low Thermal Resistance to PCB (.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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VDSS RDS(on) max (@ VGS = -10V) (@ VGS = -4.5V) Qg (typical) ID (@TA = 25°C) -30 14.6 22.5 32 -11 V m nC A Applications System/load switch, Charge or discharge switch for battery protection   D5 D6 D7 D8 IRFHM9391TRPbF HEXFET® Power MOSFET 4G   3S 2S 1S PQFN 3.3 x 3.3 mm Features Low Thermal Resistance to PCB (<3.8°C/W) Low Profile (<1.05 mm) Industry-Standard Pinout Compatible with Existing Surface Mount Techniques RoHS Compliant, Halogen-Free MSL1,Consumer Qualification Benefits Enable better Thermal Dissipation results in Increased Power Density  Multi-Vendor Compatibility Easier Manufacturing Environmentally Friendlier Increased Reliability Base part number   IRFHM9391PbF Package Type   PQFN 3.3mm x 3.
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