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IRL3302S - HEXFET Power MOSFET

Description

These HEXFET Power MOSFETs were designed specifically to meet the demands of CPU core DC-DC converters.

Advanced processing techniques combined with an optimized gate oxide design results in a die sized specifically to offer maximum efficiency at minimum cost.

Features

  • 6 0.0 0 (2 .3 6 2) M IN . N O TES : 1. C O M F O R M S T O E IA -41 8. 2. C O N T R O LL IN G D IM E N S IO N : M IL L IM E T E R . 3. D IM E N S IO N M E A S U R E D @ H U B . 4. IN C L U D E S F L A N G E D IS T O R T IO N @ O U T E R E D G E . 26.40 (1.039) 24.40 (.961) 3 3 0 .4 0 (1 .1 9 7) MAX. 4 WORLD.

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PD - 9.1692A PRELIMINARY l l l l l IRL3302S HEXFET® Power MOSFET D Advanced Process Technology Surface Mount Optimized for 4.5V-7.0V Gate Drive Ideal for CPU Core DC-DC Converters Fast Switching VDSS = 20V G S RDS(on) = 0.020W ID = 39A Description These HEXFET Power MOSFETs were designed specifically to meet the demands of CPU core DC-DC converters. Advanced processing techniques combined with an optimized gate oxide design results in a die sized specifically to offer maximum efficiency at minimum cost. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package.
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