MURS260 Key Features
- LOW PROFILE PACKAGE
- PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY 94V-0
- IDEAL FOR SURFACE MOUNTED APPLICATION
- GLASS PASSIVATED CHIP JUNCTION
- BUILT-IN STRAIN RELIEF DESIGN
- ULTRA FAST RECOVERY TIME FOR HIGH EFFICIENT
- HIGH TEMPERATURE SOLDERING: 260℃/10 SECONDS AT
- CASE: JEDEC DO-214AA MOLDED PLASTIC BODY, DIMENSIONS IN INCHES AND MILLIMETERS
- TERMINAL: SOLDER PLATED, SOLDERABLE PER MIL-STD-750 METHOD 2026
- POLARITY: COLOR BAND DENOTES CATHODE
