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TF
thin film chip fuse
EU
features
www.datasheet4u.com
dimensions and construction
c L c
• Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block in electronic devices • Suitable for flow and reflow soldering • Marking: Black body color with white marking • Products with lead-free terminations meet EU RoHS and China RoHS requirements
Type
(Inch Size Code)
L .04±.004 (1.0±0.1)
Dimensions inches (mm) W c d
t
W
Sn Plating Cu/Ni Plating
TF10BN (0402) TF16AT (0603) TF16SN (0603)
.02±.002 .008±.004 .01±.004 .015±.002 (0.5±0.05) (0.2±0.1) (0.25±0.1) (0.4±0.