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TF10BN - thin film chip fuse

Key Features

  • Small, lightweight design.
  • Special manufacturing method stabilizing fusing characteristics and occupying less area.
  • Low power consumption and less voltage drop due to low internal resistance.
  • Suitable for overcurrent protection of circuit block in electronic devices.
  • Suitable for flow and reflow soldering.
  • Marking: Black body color with white marking.
  • Products with lead-free terminations meet EU RoHS and China RoHS requirements c d.

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Datasheet Details

Part number TF10BN
Manufacturer KOA Speer Electronics
File Size 161.57 KB
Description thin film chip fuse
Datasheet download datasheet TF10BN Datasheet

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Full PDF Text Transcription (Reference)

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TF www.DataSheet4U.com thin film chip fuse EU features • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block in electronic devices • Suitable for flow and reflow soldering • Marking: Black body color with white marking • Products with lead-free terminations meet EU RoHS and China RoHS requirements c dimensions and construction c L Type (Inch Size Code) L .04±.004 (1.0±0.1) Dimensions inches (mm) W c d t W Sn Plating Cu/Ni Plating TF10BN (0402) TF16AT (0603) TF16SN (0603) .02±.002 .008±.004 .01±.004 .015±.002 (0.5±0.05) (0.2±0.1) (0.25±0.1) (0.4±0.