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MK71050-03 - Low Energy wireless module

General Description

.) 2 NC --- --- --- No connection(※Refer to PIN descriptions.) 3-4 ANT_GND --- --- --- Antenna GND(※Refer to PIN descriptions.) 5 NC --- --- --- No connection(※Refer to PIN descriptions.) 6 OUT_ANT INOUT ANA --- Output from Antenna (to be connected to OUT_MOD by user's PCB) 7 OUT_MOD IN

Key Features

  • >.
  • Bluetooth® SIG Core Spec v4.0 compliant.
  • Radio certification MIC JAPAN(certification no:006-000238) FCC(FCC ID:2ACIJ71050-3) CE(R&TTE).
  • Bluetooth® Qualification(End Product、QDID:66491).
  • Integrating ML7105C-001 Bluetooth® LE single mode LSI.
  • Integrating 26MHz xtal oscillator.
  • Integrating 128kbit EEPROM.
  • Single power supply 1.8V to 3.6V.
  • Operating Temperature -20 deg. C to 70 deg. C.
  • Current Consumptions Deep.

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Datasheet Details

Part number MK71050-03
Manufacturer LAPIS Semiconductor
File Size 596.01 KB
Description Low Energy wireless module
Datasheet download datasheet MK71050-03 Datasheet

Full PDF Text Transcription for MK71050-03 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for MK71050-03. For precise diagrams, tables, and layout, please refer to the original PDF.

MK71050-03 Bluetooth® Low Energy wireless module FEDK71050-03-01 Issue Date:Apr,10,2015 ■Overview MK71050-03 is a Bluetooth® Low Energy (here in after LE) wireless module...

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71050-03 is a Bluetooth® Low Energy (here in after LE) wireless module which is integrating ML7105C-001 Bluetooth LE SoC, E2PROM, 26MHz crystal oscillator, 2.4GHz PCB pattern antenna and passive components. It has Bluetooth® LE compliant 2.4GHz band radio communication capability. MK71050-03 is suitable for applications such as Healthcare device, Remote Controller or PC peripherals. ■Features • Bluetooth® SIG Core Spec v4.