Datasheet4U Logo Datasheet4U.com

LTV-217-G-CL - Photocoupler

Download the LTV-217-G-CL datasheet PDF. This datasheet also covers the LTV-217-G-CL-LITE variant, as both devices belong to the same photocoupler family and are provided as variant models within a single manufacturer datasheet.

General Description

1.1

Key Features

  • Current transfer ratio (CTR) : Min. 50% at IF = 5mA, VCE = 5V.
  • High input-output isolation voltage. (Viso=3,750Vrms).
  • Employs double transfer mold technology.
  • Safety approval: UL 1577, Cert. No. E113898; CSA CA5A, Cert. No.1243207 (CA 91533); FIMKO EN/IEC 60950-1, EN/IEC 60065; Cert. No. FI 24472 M1; VDE DIN EN60747-5-2, Cert. No.138213.
  • Halogen Free.
  • RoHS Compliance: All materials be used in device are followed EU RoHS directive (No.2002/95/EC).
  • ESD pass HBM.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (LTV-217-G-CL-LITE-ONElectronics.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number LTV-217-G-CL
Manufacturer LITE-ON Electronics
File Size 528.03 KB
Description Photocoupler
Datasheet download datasheet LTV-217-G-CL Datasheet

Full PDF Text Transcription for LTV-217-G-CL (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for LTV-217-G-CL. For precise diagrams, and layout, please refer to the original PDF.

Photocouplers LTV-217-G-CL 1. DESCRIPTION 1.1 Features  Current transfer ratio (CTR) : Min. 50% at IF = 5mA, VCE = 5V  High input-output isolation voltage. (Viso=3,750V...

View more extracted text
IF = 5mA, VCE = 5V  High input-output isolation voltage. (Viso=3,750Vrms)  Employs double transfer mold technology  Safety approval: UL 1577, Cert. No.E113898; CSA CA5A, Cert. No.1243207 (CA 91533); FIMKO EN/IEC 60950-1, EN/IEC 60065; Cert. No. FI 24472 M1; VDE DIN EN60747-5-2, Cert. No.138213  Halogen Free  RoHS Compliance: All materials be used in device are followed EU RoHS directive (No.2002/95/EC).  ESD pass HBM 6000V/MM2000V  MSL class1 1.2 Applications  Hybrid substrates that require high density mounting.  Programmable controllers  System appliances, measuring instruments 2. PACKAGE DIMENSIONS Part No : L