MA4SPS502 Description
and Applications This device is a silicon-glass PIN diode chip fabricated with M/A- Technology Solutions patented HMICTM process.
MA4SPS502 Key Features
- Surface Mount Device
- No Wire Bonding Required
- Rugged Silicon-Glass Construction
- Silicon Nitride Passivation
- Polymer Scratch Protection
- Low Parasitic Capacitance and Inductance
- Higher Average and Peak Power Handling
- RoHS- pliant and 260°C Reflow patible