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MA4SPS402 - PIN Diode

This page provides the datasheet information for the MA4SPS402, a member of the MA4SPS402-MA PIN Diode family.

Datasheet Summary

Description

This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process.

Features

  •  Surface Mount  No Wire Bonding Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  Higher Average and Peak Power Handling  RoHS Compliant.

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Datasheet preview – MA4SPS402

Datasheet Details

Part number MA4SPS402
Manufacturer MA-COM
File Size 719.69 KB
Description PIN Diode
Datasheet download datasheet MA4SPS402 Datasheet
Additional preview pages of the MA4SPS402 datasheet.

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Full PDF Text Transcription

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MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Features  Surface Mount  No Wire Bonding Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  Higher Average and Peak Power Handling  RoHS Compliant Description This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device.
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