MA4SPS402 Datasheet | MACOM Technology Solutions

SURMOUNTTM PIN Diode RoHS pliant Features  Surface Mount  No Wire Bonding Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  Higher Average and Peak Power Handling  RoHS pliant Description This device is a Silicon-Glass PIN diode chip fabricated with M/A- Technology Solutions patented HMICTM process. This device Features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside...