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MA4SPS402 - PIN Diode

Download the MA4SPS402 datasheet PDF. This datasheet also covers the MA4SPS402-MA variant, as both devices belong to the same pin diode family and are provided as variant models within a single manufacturer datasheet.

General Description

This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process.

Key Features

  •  Surface Mount  No Wire Bonding Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  Higher Average and Peak Power Handling  RoHS Compliant.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MA4SPS402-MA-COM.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Features  Surface Mount  No Wire Bonding Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  Higher Average and Peak Power Handling  RoHS Compliant Description This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device.