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MA4SPS502 - PIN Diode

This page provides the datasheet information for the MA4SPS502, a member of the MA4SPS502-MA PIN Diode family.

Datasheet Summary

Description

This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process.

Features

  • Surface Mount Device.
  • No Wire Bonding Required.
  • Rugged Silicon-Glass Construction.
  • Silicon Nitride Passivation.
  • Polymer Scratch Protection.
  • Low Parasitic Capacitance and Inductance.
  • Higher Average and Peak Power Handling.
  • RoHS.
  • Compliant and 260°C Reflow Compatible Case Style Outline Drawing ODS-12701,2.

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Datasheet preview – MA4SPS502

Datasheet Details

Part number MA4SPS502
Manufacturer MA-COM
File Size 701.54 KB
Description PIN Diode
Datasheet download datasheet MA4SPS502 Datasheet
Additional preview pages of the MA4SPS502 datasheet.

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Full PDF Text Transcription

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MA4SPS502 SURMOUNTTM PIN Diode Rev. V3 Features  Surface Mount Device  No Wire Bonding Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  Higher Average and Peak Power Handling  RoHS* Compliant and 260°C Reflow Compatible Case Style Outline Drawing ODS-12701,2 Description and Applications This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive.
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