Datasheet Summary
SURMOUNTTM PIN Diode
Rev. V3
Features
- Surface Mount Device
- No Wire Bonding Required
- Rugged Silicon-Glass Construction
- Silicon Nitride Passivation
- Polymer Scratch Protection
- Low Parasitic Capacitance and Inductance
- Higher Average and Peak Power Handling
- RoHS- pliant and 260°C Reflow patible
Case Style Outline Drawing ODS-12701,2
Description and Applications
This device is a silicon-glass PIN diode chip fabricated with M/A- Technology Solutions patented HMICTM process. This device Features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by...