MXC4006XC
Overview
The MEMSIC Three-Axis Thermal Accelerometer is based on MEMSIC’s Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging.
- Ultra Low Cost
- Most Advantaged Technology in Industry
- Monolithically-Integrated Single Chip MEMS Sensor with On-Chip Signal Processing
- MEMSIC Proprietary Technology with No Moving Parts
- >200,000g Shock Survival Rating of Sensing Structure
- 12-bit Signal Output for X, Y and Z Axes
- Full Scale Range ±2g, ±4g and ±8g
- 8-bit Temperature Output (-50°C to +100°C)
- Smallest Wafer Level Package (WLP) Footprint
- 18mm×1.70mm×0.85mm
