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MMG10CB120XB6TC - PIM

Key Features

  • IGBT CHIP(Trench+Field Stop technology).
  • Substrate for Low Thermal Resistance.
  • Low saturation voltage and positive temperature coefficient.
  • Fast switching and short tail current.
  • Free wheeling diodes with fast and soft reverse recovery.
  • Solder Contact Technology, Rugged mounting due to integrated Mounting clamps.
  • Temperature sense included.

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Full PDF Text Transcription (Reference)

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November 2019 MMG10CB120XB6TC Version 01 1200V 10A PIM Module RoHS Compliant PRODUCT FEATURES □ IGBT CHIP(Trench+Field Stop technology) □ Substrate for Low Thermal Resistance □ Low saturation voltage and positive temperature coefficient □ Fast switching and short tail current □ Free wheeling diodes with fast and soft reverse recovery □ Solder Contact Technology, Rugged mounting due to integrated Mounting clamps □ Temperature sense included APPLICATIONS □ AC motor control □ Motion/servo control □ Inverter and power supplies Rectifier+Brake+Inverter IGBT-inverter ABSOLUTE MAXIMUM RATINGS(T C =25°C unless otherwise specified) Symbol Parameter/Test Conditions VCES Collector Emitter Voltage TJ=25℃ VGES Gate Emitter Voltage IC DC Collector Current TC=25℃, TJmax=175℃ TC=105℃, TJma