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Maxim Integrated Semiconductor Electronic Components Datasheet

MAX11167 Datasheet

SAR ADC

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EVALUATION KIT AVAILABLE
MAX11167
16-Bit, 250ksps, ±5V SAR ADC with Internal
Reference in TDFN
General Description
The MAX11167 16-bit, 250ksps, SAR ADC offers excel-
lent AC and DC performance with true bipolar input range,
small size, and internal reference. The MAX11167 mea-
sures a Q5V (10VP-P) input range while operating from
a single 5V supply. A patented charge-pump architecture
allows direct sampling of high-impedance sources. The
MAX11167 integrates an optional 6.7ppm/NC reference
with internal buffer, saving the cost and space of an exter-
nal reference.
This ADC achieves 93.2dB SNR and -102.5dB THD. The
MAX11167 guarantees 16-bit no-missing codes and Q0.5
LSB INL (typ).
The MAX11167 communicates using an SPI-compatible
serial interface at 2.5V, 3V, 3.3V, or 5V logic. The serial
interface can be used to daisy-chain multiple ADCs in
parallel for multichannel applications and provides a busy
indicator option for simplified system synchronization and
timing.
The MAX11167 is offered in a 12-pin, 3mm x 3mm, TDFN
package and is specified over the -40NC to +85NC tem-
perature range.
Applications
Data Acquisition Systems
Industrial Control Systems/Process Control
Medical Instrumentation
Automatic Test Equipment
Typical Operating Circuit
VDD
(5V)
1µF
VOVDD
(2.3V TO 5V)
1µF
MAX9632
±5V
10AIN+
AIN-
4.7nF
REF
10µF
16-BIT ADC
INTERFACE
AND
CONTROL
MAX11167
SCLK
DIN
DOUT
CNVST
HOST
µC
REF
BUF
AGNDS
INTERNAL
REFERENCE
GND
REFIO
0.1µF
Benefits and Features
● High DC/AC Accuracy Improves Measurement
Quality
• 16-Bit Resolution with No Missing Codes
• 250ksps Throughput Rate Without Pipeline Delay/
Latency
• 93.2dB SNR and -102.5dB THD at 10kHz
• 0.5 LSBRMS Transition Noise
• ±0.2 LSB DNL (typ) and ±0.4 LSB INL (typ)
● Highly Integrated ADC Saves Cost and Space
• ±6.7ppm/°C Internal Reference
• Internal Reference Buffer
● Wide Supply Range and Low Power Simplify Power-
Supply Design
• 5V Analog Supply
• 2.3V to 5V Digital Supply
• 21.2mW Power Consumption at 250ksps
10μA in Shutdown Mode
● Multi-Industry Standard Serial Interface and Small
Package Reduce Size
• SPI/QSPI™/MICROWIRE®/DSP-Compatible
Serial Interface
• 3mm x 3mm Tiny 12-Pin TDFN Package
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National
Semiconductor Corporation.
14-Bit to 18-Bit SAR ADC Family
±5V Input
Internal
Reference
0 to 5V Input
Internal
Reference
0 to 5V Input
External
Reference
14-BIT
500ksps
16-BIT
250ksps
16-BIT
18-BIT
500ksps 500ksps
MAX11167 MAX11166 MAX11156
MAX11169 MAX11168 MAX11158
MAX11161 MAX11160 MAX11150
MAX11165 MAX11164 MAX11154
MAX11262 MAX11163 MAX11162 MAX11152
Selector Guide and Ordering Information appear at end of
data sheet.
19-6445; Rev 4; 5/15


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX11167 Datasheet

SAR ADC

No Preview Available !

MAX11167
16-Bit, 250ksps, ±5V SAR ADC
with Internal Reference in TDFN
Absolute Maximum Ratings
VDD to GND.............................................................-0.3V to +6V
OVDD to GND........ -0.3V to the lower of (VDD + 0.3V) and +6V
AIN+ to GND......................................................................... Q7V
AIN-, REF, REFIO, AGNDS
to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V
SCLK, DIN, DOUT, CNVST
to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V
Maximum Current into Any Pin...........................................50mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 18.2mW/NC above +70NC)...................1349mW
Operating Temperature Range............................ -40NC to +85NC
Junction Temperature.......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................. +300NC
Soldering Temperature (reflow)........................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (qJA).......59.3NC/W
Junction-to-Case Thermal Resistance (qJC)............22.5NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = 4.75V to 5.25V, VOVDD = 2.3V to 5.25V, fSAMPLE = 250ksps, VREF = 4.096V; TA = TMIN to TMAX, unless otherwise noted.
Typical values are at TA = +25NC.) (Note 2)
PARAMETER
ANALOG INPUT (Note 3)
Input Voltage Range
SYMBOL
CONDITIONS
5.000
AIN+ to AIN-, K = 4.096
MIN TYP MAX UNITS
-K x VREF
+K x VREF
V
Absolute Input Voltage Range
Input Leakage Current
Input Capacitance
Input-Clamp Protection Current
STATIC PERFORMANCE
Resolution
No Missing Codes
Offset Error
Offset Temperature Coefficient
Gain Error
Gain Error Temperature
Coefficient
Integral Nonlinearity
Differential Nonlinearity
Positive Full-Scale Error
AIN+ to GND
AIN- to GND
Acquisition phase
Both inputs
N
INL
DNL
Guaranteed by design
-(VDD +
0.1)
+(VDD +
0.1)
-0.1 +0.1
-10 +0.001 +10
15
-20 +20
V
µA
pF
mA
16 Bits
16 Bits
-7.5 ±0.7 +7.5 LSB
±0.006
LSB/°C
-3.5 ±1.6 +3.5 LSB
±0.007
LSB/°C
-1.2 ±0.4 +1.2 LSB
-0.5 ±0.2 +0.5 LSB
-8 +8 LSB
www.maximintegrated.com
Maxim Integrated 2


Part Number MAX11167
Description SAR ADC
Maker Maxim Integrated
Total Page 28 Pages
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