MAX2090
50MHz to 1000MHz Analog VGA with Threshold
Alarm Circuit and Error Amplifier for Level Control
ABSOLUTE MAXIMUM RATINGS
VCC_A, VCC_RF.........................................................-0.3V to +6V
RF_IN, RF_OUT......................................... -0.3V to (VCC + 0.3V)
R_BIAS, ALM_THRES, PLVLSET,
AMP OUT...........................................................-0.3V to +3.6V
CTRL1, CTRL2......................................................-0.3V to +3.6V
ALM.......................................................................-0.3V to +3.6V
DET_VIN ...............................................................-0.3V to +3.6V
RF_IN Input Power......................................................... +15dBm
RF_OUT Output Power .................................................. +20dBm
Continuous Power Dissipation (Note 1)...............................2.5W
Operating Case Temperature Range (Note 2)... -40NC to +95NC
Maximum Junction Temperature......................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Note 1: Based on junction temperature TJ = TC + (qJC x VCC x ICC). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient Thermal Resistance qJA (Notes 3, 4)...+29NC/W
Junction-to-Case Thermal Resistance qJC (Notes 1, 4)..........7NC/W
Note 3: Junction temperature TJ = TA + (qJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 4.75V to 5.8V, VGND = 0V, and TC = -40NC to +95NC. Typical values are at VCC = 5.5V,
VPLVLSET = 2.5V, and TC = +25NC, unless otherwise noted.) (Note 5)
PARAMETER
Supply Voltage
Total Supply Current
CTRL1/CTRL2 Logic-Low Input
Voltage
CTRL1/CTRL2 Logic-High Input
Voltage
CTRL1/CTRL2 Input Logic
Current
PLVLSET Input Resistance
PLVLSET Input Voltage Range
PLVLSET Minimum Control
Voltage
SYMBOL
VCC
IDC
CONDITIONS
CTRL1 = 1, CTRL2 = 1
CTRL1 = 1, CTRL2 = 0
CTRL1 = 0, CTRL2 = 0
VIL
VIH
IIH, IIL
RIN
MIN
4.75
TYP
5.0
81
71
5.7
MAX
5.8
110
100
15
0.8
UNITS
V
mA
V
2.2 V
-10 +10
650
0 2.5
0 0.1 0.2
FA
kI
V
V
Maxim Integrated
2
