Maxim Integrated Semiconductor Electronic Components Datasheet

MAX40018 Datasheet

Dual nanoPower Op Amps

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MAX40018

EVALUATION KIT AVAILABLE

Dual nanoPower Op Amps

in Tiny WLP and TDFN Packages

General Description

The MAX40018 is a dual operational amplifier that

consumes only 400nA supply current (per channel). At

such low power consumption, the device is ideal for

battery-powered applications such as portable medical

equipment, portable instruments and wireless handsets.

The MAX40018 operates from a single 1.7V to 5.5V

supply, allowing the device to be powered by the same

1.8V, 2.5V, or 3.3V nominal supply that powers the

microcontroller. The MAX40018 features rail-to-rail

outputs and is unity-gain stable with a 9kHz gain bandwidth

product (GBP).

The ultra-low supply current, ultra-low input bias current,

low operating voltage, and rail-to-rail output capabilities

make this dual operational amplifier ideal for use with single

lithium-ion (Li+), or two-cell NiCd or alkaline batteries.

The MAX40018 is available in a tiny, 8-bump, 1.63mm x

0.91mm wafer-level package (WLP), with a bump pitch

of 0.4mm, as well as in an 8-pin 3mm x 3mm TDFN

package. The device is specified over the -40°C to

+125°C, automotive temperature range.

Applications

●● Wearable Devices

●● Handheld Devices

●● Notebook and Tablet Computers

●● Portable Medical Devices

●● Portable Instrumentation

Benefits and Features

●● Ultra-Low Power Preserves Battery Life

• 400nA Typical Supply Current (Per Channel)

●● Single 1.7V to 5.5V Supply Voltage Range

• The Device Can be Powered From the Same

1.8V/2.5V/3.3V/5V System Rails

●● Tiny Packages Save Board Space

• 1.63mm x 0.91mm x 0.5mm WLP-8 with 0.4mm

Bump Pitch

• 3mm x 3mm x 0.75mm TDFN-8 Package

●● Precision Specifications for Buffer/Filter/Gain Stages

• Low 350μV Input Offset Voltage

• Rail-to-Rail Output Voltage

• 9kHz GBP

• Low 0.1pA Input Bias Current

• Unity-Gain Stable

●● -40°C to +125°C Temperature Range

Ordering Information appears at end of data sheet.

Simplified Block Diagram

VDD

IN1+

OUT1

IN1-

IN2+

IN2-

MAX40018

VSS

OUT2

19-100227; Rev 3; 11/19

Maxim Integrated Semiconductor Electronic Components Datasheet

MAX40018 Datasheet

Dual nanoPower Op Amps

No Preview Available !

MAX40018

Dual nanoPower Op Amps

in Tiny WLP and TDFN Packages

Absolute Maximum Ratings

VDD to VSS...............................................................-0.3V to +6V

OUT_ to VSS.......................................VSS - 0.3V to VDD + 0.3V

IN_+, IN_- to VSS................................VSS - 0.3V to VDD + 0.3V

IN_+ to IN_-............................................................................±2V

Continuous Current Into Any Input Pin..............................±10mA

Continuous Current Into Any Output Pin...........................±20mA

Output Short-Circuit Duration to VDD or VSS......................... 10s

Continuous Power Dissipation (TA = +70°C; 8-Bump WLP,

derate 11.4mW/°C above +70°C).................................912mW

Continuous Power Dissipation (TA = +70°C; TDFN-8,

derate 24.4mW/°C above +70°C)............................1951.2mW

Operating Temperature Range.......................... -40°C to +125°C

Junction Temperature.......................................................+150°C

Storage Temperature Range............................. -65°C to +150°C

Lead Temperature (soldering, 10s).................................. +300°C

Reflow Soldering Peak Temperature (Pb-free)................ +260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

TDFN-8

PACKAGE CODE

T833+2

Outline Number

21-0137

Land Pattern Number

90-0059

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

Junction to Case (θJC)

WLP-8

41°C/W

8°C/W

PACKAGE CODE

N80B1+1

Outline Number

21-100228

Land Pattern Number

Refer to Application Note 1891

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

87.71°C/W

Junction to Case (θJC)

N/A

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(VDD = +3V, VSS = 0V, VCM = 0.5V, VOUT = VDD/2, RL = 1MΩ to VDD/2, TA = +25°C, unless otherwise noted (Note 1).)

PARAMETER

Supply Voltage Range

Supply Current (Dual)

SYMBOL

VDD

IDD

CONDITIONS

Guaranteed by PSRR tests

TA = +25°C

TA = -40°C to +85°C

TA = -40°C to +125°C

MIN

TYP

MAX

1.7 5.5

0.8 1.3

1.4

1.6

UNITS

μA

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MAX40018 Datasheet

Dual nanoPower Op Amps

MAX40018 Datasheet

Dual nanoPower Op Amps

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