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Maxim Integrated Semiconductor Electronic Components Datasheet

DS1343 Datasheet

(DS1343 / DS1344) Low-Current SPI/3-Wire RTCs

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19-5801; Rev 0; 3/11
Low-Current SPI/3-Wire RTCs
General Description
The DS1343/DS1344 low-current real-time clocks (RTCs)
are timekeeping devices that provide an extremely low
standby current, permitting longer life from a backup
supply source. The devices also support high-ESR
crystals, broadening the pool of usable crystals for the
devices. The clock/calendar provides seconds, minutes,
hours, day, date, month, and year information. The date
at the end of the month is automatically adjusted for
months with fewer than 31 days, including corrections
for leap year. The clock operates in either 24-hour or
12-hour format with an AM/PM indicator.
Address and data are transferred serially through an
SPI™ or 3-wire interface. Two programmable time-of-day
alarms are provided. Each alarm can generate an inter-
rupt on a combination of seconds, minutes, hours, and
day. Don’t-care states can be inserted into one or more
fields if it is desired for them to be ignored for the alarm
condition. The time-of-day alarms can be programmed
to assert two different interrupt outputs, or they can be
combined to assert one common interrupt output. Both
interrupt outputs operate when the device is powered by
either VCC or VBAT.
The devices are available in a lead-free/RoHS-compliant,
20-pin TSSOP or 14-pin TDFN package, and support a
-40°C to +85°C extended industrial temperature range.
Medical
Handheld Devices
Telematicswww.DataSheet4U.net
Embedded Timestamping
Applications
Ordering Information appears at end of data sheet.
Features
S Low Timekeeping Current of 250nA (typ)
S Compatible with Crystal ESR Up to 100kI
S Versions Available to Support Either 6pF or
12.5pF Crystals
S RTC Counts Seconds, Minutes, Hours, Day, Date,
Month, and Year with Leap Year Compensation
Valid Through 2099
S Power-Fail and Switch Circuitry
S Three Operating Voltages
1.8V ±5%
3.0V±10%
3.3V ±10%
S Trickle-Charge Capability
S Maintain Time Down to 1.15V (typ)
S Support Motorola SPI Modes 1 and 3, or Standard
3-Wire Interface
S Burst Mode for Reading/Writing Successive
Addresses in Clock/RAM
S 96-Byte Battery-Backed NV RAM for Data Storage
S Two Time-of-Day Alarms with Two Interrupt
Outputs
S Industrial Temperature Range
S 20-Pin TSSOP or 14-Pin TDFN Package
Typical Operating Circuit
VCC
RPU
INT
RST
μP
3-WIRE
PORT
VCC
INT0
PF
INT1
CE
SCLK
SDI
SDO
DS1343
DS1344
X1
X2
VBAT
SERMODE GND
NOTE: SHOWN IN 3-WIRE I/O CONFIGURATION.
SPI is a trademark of Motorola, Inc.
________________________________________________________________ Maxim Integrated Products   1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.


Maxim Integrated Semiconductor Electronic Components Datasheet

DS1343 Datasheet

(DS1343 / DS1344) Low-Current SPI/3-Wire RTCs

No Preview Available !

Low-Current SPI/3-Wire RTCs
ABSOLUTE MAXIMUM RATINGS
Voltage Range on VCC or VBAT
Relative to Ground............................................-0.3V to +6.0V
Voltage Range on Any Nonpower Pin
Relative to Ground................................ -0.3V to (VCC + 0.3V)
Operating Temperature Range........................... -40NC to +85NC
Junction Temperature Maximum.....................................+150NC
Storage Temperature Range............................ -55NC to +125NC
Lead Temperature (soldering, 10s).................................+260NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (BJA)...........91NC/W
Junction-to-Case Thermal Resistance (BJC)................20NC/W
TDFN
Junction-to-Ambient Thermal Resistance (BJA)...........54NC/W
Junction-to-Case Thermal Resistance (BJC)..................8NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
RECOMMENDED OPERATING CONDITIONS
(TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER
Operating Voltage Range
Minimum Timekeeping Voltage
Backup Voltage
SYMBOL
VCC
VBATTMIN
VBAT
DS134_-18
DS134_-3
DS134_-33
TA = +25NC
CONDITIONS
Logic 1 Input
VIH
Logic 0 Input
www.DataSheet4U.net
VIL
MIN
1.71
2.7
3.0
1.3
0.7 x
VCC
-0.3
TYP
1.8
3.0
3.3
1.15
MAX
5.5
5.5
5.5
1.3
5.5
VCC +
0.3
0.3 x
VCC
UNITS
V
V
V
V
V
DC ELECTRICAL CHARACTERISTICS
(VCC = VCC(MIN) to +5.5V, VBAT = +1.3V to +5.5V, TA = -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER
Power-Supply Active Current
Power-Supply Standby Current
(Note 5)
Backup Current
(Oscillator Off)
SYMBOL
ICCA
ICCS
CONDITIONS
-3 or -33: fSCLK = 4MHz (Note 4)
-33: VCC = 3.63V
VCC = VCC(MAX)
IBAT
TA = +25NC, VCC = 0V, EOSC = 1
MIN TYP
Backup Current
DS1343 (Note 6)
Backup Current
DS1343 (Note 7)
IBAT1
IBAT2
VBAT = 3V
VBAT = VBAT(MAX)
VBAT = 3V
VBAT = VBAT(MAX)
250
300
MAX
600
120
160
100
500
600
UNITS
FA
FA
nA
nA
nA
2


Part Number DS1343
Description (DS1343 / DS1344) Low-Current SPI/3-Wire RTCs
Maker Maxim Integrated Products
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DS1343 Datasheet PDF






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