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Maxim Integrated Semiconductor Electronic Components Datasheet

MAX19997A Datasheet

1800MHz to 2900MHz Downconversion Mixer

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MAX19997A
Dual, SiGe High-Linearity, 1800MHz to 2900MHz
Downconversion Mixer with LO Buffer
General Description
The MAX19997A dual downconversion mixer is a versa-
tile, highly integrated diversity downconverter that pro-
vides high linearity and low noise figure for a multitude of
1800MHz to 2900MHz base-station applications. The
MAX19997A fully supports both low- and high-side LO
injection architectures for the 2300MHz to 2900MHz
WiMAX™, LTE, WCS, and MMDS bands, providing
8.7dB gain, +24dBm input IP3, and 10.3dB NF in the
low-side configuration, and 8.7dB gain, +24dBm input
IP3, and 10.4dB NF in the high-side configuration. High-
side LO injection architectures can be further extended
down to 1800MHz with the addition of one tuning ele-
ment (a shunt inductor) on each RF port.
The device integrates baluns in the RF and LO ports,
an LO buffer, two double-balanced mixers, and a pair
of differential IF output amplifiers. The MAX19997A
requires a typical LO drive of 0dBm and a supply cur-
rent guaranteed below 420mA to achieve the targeted
linearity performance.
The MAX19997A is available in a compact 6mm x 6mm,
36-pin TQFN lead-free package with an exposed pad.
Electrical performance is guaranteed over the extended
temperature range, from TC = -40°C to +100°C.
Applications
2.3GHz WCS Base Stations
2.5GHz WiMAX and LTE Base Stations
2.7GHz MMDS Base Stations
UMTS/WCDMA and cdma2000® 3G Base
Stations
PCS1900 and EDGE Base Stations
PHS/PAS Base Stations
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Features
o 1800MHz to 2900MHz RF Frequency Range
o 1950MHz to 3400MHz LO Frequency Range
o 50MHz to 550MHz IF Frequency Range
o Supports Both Low-Side and High-Side LO
Injection
o 8.7dB Conversion Gain
o +24dBm Input IP3
o 10.3dB Noise Figure
o +11.3dBm Input 1dB Compression Point
o 70dBc Typical 2 x 2 Spurious Rejection at
PRF = -10dBm
o Dual Channels Ideal for Diversity Receiver
Applications
o Integrated LO Buffer
o Integrated LO and RF Baluns for Single-Ended
Inputs
o Low -3dBm to +3dBm LO Drive
o Pin Compatible with the MAX19999 3000MHz to
4000MHz Mixer
o Pin Similar to the MAX9995 and MAX19995/
MAX19995A 1700MHz to 2200MHz Mixers and the
MAX9985 and MAX19985A 700MHz to 1000MHz
Mixers
o 42dB Channel-to-Channel Isolation
o Single 5.0V or 3.3V Supply
o External Current-Setting Resistors Provide Option
for Operating Device in Reduced-Power/Reduced-
Performance Mode
Ordering Information
PART
TEMP RANGE PIN-PACKAGE
MAX19997AETX+
-40°C to +100°C 36 TQFN-EP*
MAX19997AETX+T
-40°C to +100°C 36 TQFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
T = Tape and reel.
WiMAX is a trademark of WiMAX Forum.
cdma2000 is a registered trademark of Telecommunications
Industry Association.
Pin Configuration/Functional Block Diagram appears at
end of data sheet.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-4288; Rev 4; 1/13


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX19997A Datasheet

1800MHz to 2900MHz Downconversion Mixer

No Preview Available !

MAX19997A
Dual, SiGe High-Linearity, 1800MHz to 2900MHz
Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +5.5V
RF_, LO to GND.....................................................-0.3V to +0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LO_ADJ_M,
LO_ADJ_D to GND.................................-0.3V to (VCC + 0.3V)
RF_, LO Input Power ......................................................+15dBm
RF_, LO Current (RF_ and LO is DC
shorted to GND through balun)................................... ...50mA
Continuous Power Dissipation (Note 1) ..............................6.5W
PACKAGE THERMAL CHARACTERISTICS
Operating Case Temperature Range
(Note 4) .................................................TC = -40°C to +100°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Junction-to-Ambient Thermal Resistance (θJA)
(Notes 2, 3)...................................................................38°C/W
Junction-to-Board Thermal Resistance (θJB)................12.2°C/W
Junction-to-Case Thermal Resistance (θJC)
(Notes 1, 3)..................................................................7.4°C/W
Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit optimized for the standard RF band (see Table 1), no input RF or LO signals applied, VCC = 4.75V to
5.25V, TC = -40°C to +85°C. Typical values are at VCC = 5.0V, TC = +25°C, unless otherwise noted. R1, R4 = 750, R2, R5 = 698.)
PARAMETER
Supply Voltage
Total Supply Current
VCC (Pin 4) Supply Current
(Main and Diversity Paths)
SYMBOL
VCC
ICC
VCC = 5.0V
VCC = 5.25V
CONDITIONS
VCC = 5.25V
MIN TYP MAX UNITS
4.75 5.25 V
388
390.4
420
mA
2.5 mA
VCC (Pin 10) Supply Current
(Diversity Path)
VCC = 5.25V
8.9 mA
VCC (Pin 16) Supply Current
(Diversity Path)
VCC = 5.25V
109.3
mA
VCC (Pin 21) Supply Current
(Main and Diversity Paths)
VCC = 5.25V
28.3 mA
VCC (Pin 30) Supply Current
(Main Path)
VCC = 5.25V
109.3
mA
VCC (Pin 36) Supply Current
(Main Path)
VCC = 5.25V
8.9 mA
IFM Bias Supply Current (Main
Path)
IFD Bias Supply Current
(Diversity Path)
Total bias feeding IFM- and IFM+ through
61.6
mA
R3, L1 and L2; VCC = 5.25V
Total bias feeding IFD+ and IFD- through
R6, L3 and L4; VCC = 5.25V
61.6 mA
2 Maxim Integrated


Part Number MAX19997A
Description 1800MHz to 2900MHz Downconversion Mixer
Maker Maxim Integrated Products
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