W82M32V-XBX - 2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE

Key Features

 Access Times of 12, 15, 17, 20ns.
 Packaging.
255 PBGA, 25mm x 25mm, 625mm2.
 Organized as 2Mx32.
 Commercial, Industrial and Military Temperature Ranges.
 Low Voltage Operation:.
3.3V ± 10% Power Supply.
 Low Power CMOS.
 TTL Compatible Inputs and Outputs.
 Fully Static Operation:.
No clock or refresh required.
 Three State Output.
This product is subject to change without notice. 1 A B NC C NC D NC E NC F NC G N.

W82M32V-XBX 2m x 32 sram 3.3v multi-chip package by Mercury - Datasheet Preview

Datasheet Details

Part number	W82M32V-XBX
Manufacturer	Mercury
File Size	733.46 KB
Description	2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE
Datasheet	W82M32V-XBX Datasheet

Full PDF Text Transcription for W82M32V-XBX (Reference)

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2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE W82M32V-XBX FEATURES  Access Times of 12, 15, 17, 20ns  Packaging • 255 PBGA, 25mm x 25mm, 625mm2  Organized as 2Mx32  Commerci...

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ging • 255 PBGA, 25mm x 25mm, 625mm2  Organized as 2Mx32  Commercial, Industrial and Military Temperature Ranges  Low Voltage Operation: • 3.3V ± 10% Power Supply  Low Power CMOS  TTL Compatible Inputs and Outputs  Fully Static Operation: • No clock or refresh required.  Three State Output. * This product is subject to change without notice.

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