W82M32V-XBX - 2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE

Features

ES.
Access Times of 12, 15, 17, 20ns.
Packaging.
255 PBGA, 25mm x 25mm, 625mm2.
Organized as 2Mx32.
Commercial, Industrial and Military Temperature Ranges.
Low Voltage Operation:.
3.3V ± 10% Power Supply.
Low Power CMOS.
TTL Compatible Inputs and Outputs.
Fully Static Operation:.
No clock or refresh required.
Three State Output.
Advanced data sheet describes a product that is devel.

White Electronic Designs

Datasheet Details

Part number	W82M32V-XBX
Manufacturer	White Electronic Designs
File Size	223.50 KB
Description	2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE
Datasheet	W82M32V-XBX Datasheet
Additional preview pages of the W82M32V-XBX datasheet.

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Full PDF Text Transcription

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W82M32V-XBX 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES Access Times of 12, 15, 17, 20ns Packaging • 255 PBGA, 25mm x 25mm, 625mm2 Organized as 2Mx32 Commercial, Industrial and Military Temperature Ranges Low Voltage Operation: • 3.3V ± 10% Power Supply Low Power CMOS TTL Compatible Inputs and Outputs Fully Static Operation: • No clock or refresh required. Three State Output. * Advanced data sheet describes a product that is developmental, non-qualified and is subject to change or cancellation without notice.

Published: Dec 30, 2018 |