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W82M32V-XBX - 2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE

Features

  •  Access Times of 12, 15, 17, 20ns.
  •  Packaging.
  • 255 PBGA, 25mm x 25mm, 625mm2.
  •  Organized as 2Mx32.
  •  Commercial, Industrial and Military Temperature Ranges.
  •  Low Voltage Operation:.
  • 3.3V ± 10% Power Supply.
  •  Low Power CMOS.
  •  TTL Compatible Inputs and Outputs.
  •  Fully Static Operation:.
  • No clock or refresh required.
  •  Three State Output.
  • This product is subject to change without notice. 1 A B NC C NC D NC E NC F NC G N.

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Datasheet preview – W82M32V-XBX

Datasheet Details

Part number W82M32V-XBX
Manufacturer Mercury
File Size 733.46 KB
Description 2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE
Datasheet download datasheet W82M32V-XBX Datasheet
Additional preview pages of the W82M32V-XBX datasheet.

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    Full PDF Text Transcription

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    2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE W82M32V-XBX FEATURES  Access Times of 12, 15, 17, 20ns  Packaging • 255 PBGA, 25mm x 25mm, 625mm2  Organized as 2Mx32  Commercial, Industrial and Military Temperature Ranges  Low Voltage Operation: • 3.3V ± 10% Power Supply  Low Power CMOS  TTL Compatible Inputs and Outputs  Fully Static Operation: • No clock or refresh required.  Three State Output. * This product is subject to change without notice.
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