LQFP64
feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1080 Rev. A Sheet 2 of 2
© 2019 Microchip Technology Incorporated
64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP] With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://.microchip./packaging
C1 X2 EV
C2 Y2 EV
SILK SCREEN
ØV G1
Y1 X1
REMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X64)
X1
Contact Pad Length (X64)
Y1
Contact Pad to Contact Pad (X60) G1
Thermal Via...
