| Part Number | LQFP64 Datasheet |
|---|---|
| Manufacturer | Microchip Technology |
| Overview | 64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP] With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy Note: For the most current package drawings, please see . may vary, but must be located within the hatched area. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-108. |
LQFP64 Datasheet and Specifications PDF
The LQFP64 is a 64-Lead Low-Profile Plastic Quad Flat Pack Package.
| Part Number | LQFP64 Datasheet |
|---|---|
| Description | Pin Assignment |
| Manufacturer | i2Chip |
| Overview | Pin Assignment / / TX_CLK MODE0 TXD[3] TXD[2] TXD[1] 50 64 RESET VCC GND CLOCK A[14]/DA[6] A[13]/DA[5] A[12]/DA[4] A[11]/DA[3] A[10]/DA[2] A[9]/DA[1] A[8]/DA[0] VCC GND A[7] A[6] A[5] 1 2 3 4 5 . ƄŬŪũũŴ % Ƌƌş %' ş ƌş ƌş %' %' %' %' %' %' %' %' ş ş ş ş ş ş ş ş ƌş ƌş %' %' %' %' %' %' %' %' ş ş ş ş ş ş ş ş ƌş ƌş %Ũżş %Ũżş %Ũżş %Ũżş ŬŬş Ŭŭş ŬŮş Ŭůş ŬŰş Ŭűş Ŭ$ş ŭũş ŭŪş ŭūş ŭŬş ŭŭş ŭŮş ŭůş ŭŰş ŭűş ŭ$ş Ůũş ŮŪş Ůūş ŮŬş Ůŭş ŮŮş Ůůş ŮŰş Ůűş Ů$ş ş ůũş ůŪş ůūş ůŬş ůŭş ş ş % 'Ɖƌ ş ş ş %ƈ'ƌş ŨŹŷŽ%ƅş . |
| Part Number | LQFP64 Datasheet |
|---|---|
| Description | low profile quad flat package |
| Manufacturer | NXP Semiconductors |
| Overview | , at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT1699-1 Package information All information provided in this docum. is subject to legal disclaimers. 22 November 2019 © NXP B.V. 2019. All rights reserved. 2/6 NXP Semiconductors SOT1699-1 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body Figure 2. Package outline detail of LQFP64 (sot1699-1) SOT1699-1 Pac. |
| Part Number | LQFP64 Datasheet |
|---|---|
| Description | Plastic Packages |
| Manufacturer | Renesas |
| Overview | Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Packages (LQFP) D D1 -D- -A- -B- E E1 PIN 1 -H- GAGE PLANE 0.020 0.008 MIN 0o MIN L 0.25 0o-7o 0.010 e SEATING A PLANE 0.08. ns D and E to be determined at seating plane -C- . 4. Dimensions D1 and E1 to be determined at datum plane -H- . 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protru. |