SST12LF09
SST12LF09 is WLAN Front-End Module manufactured by Microchip Technology.
FEATURES
- Input/output ports internally matched to 50 and DC decoupled
- Package available
- 16-contact X2QFN
- 2.5mm x 2.5mmx 0.4mm
- All non-Pb (lead-free) devices are Ro HS pliant
Transmitter Chain
- Gain:
- Typically 24 d B gain
- Dynamic linear output power:
- Meets 802.11g OFDM ACPR requirement up to 21 d Bm using 3.6V VCC and 22.5 d Bm using 5V VCC
- 17 d Bm using 3.6V, 18 d Bm using 5.0V, at 3% EVM for 802.11g, 54 Mbps
- 15 d Bm using 3.6V, 16 d Bm using 5.0V, at 1.75% dynamic EVM for 256 QAM, 40 MHz bandwidth
- Operating current
- 150 m A @ POUT = 17 d Bm for 802.11g, 3.6V
- 130 m A @ POUT = 15 d Bm for MCS9, 3.6V
- PA Control current, IPEN:<3 m A
- Idle current, ICQ:90 m A (3.6V VCC)
- Low shut-down current: ~2 μA
- Power-up/down control
- Turn on/off time (10%- 90%) <400 ns
- Limited variation over temperature
- ~1 d B power variation between -40°C to +85°C
- Linear on-chip power detection
-...
