Overview: Surface Mount—MELF PIN Diodes
UMX502—UMX812 Product Overview This line of metal electrode leadless face (MELF) high–power PIN diodes consists of hermetically sealed surface mount packaged devices with full–face bonded chips for low–inductance construction. The MELF ceramic package has square–end terminations, which are ideal for surface mount and pick–and–place operations. The PIN diodes chips are coated with a special hard glass passivation, which is required both for high–power applications and to enhance the reliability, resulting in mean time between failures (MTBFs) of greater than one million hours. These RoHS–compliant products meet the requirements of EU Directive 2002/95/EC. The standard terminal finish is matte tin unless otherwise specified. Alternative terminal finishes are available.
