UMX512 Datasheet | Microchip Technology

Overview This line of metal electrode leadless face (MELF) high- power PIN diodes consists of hermetically sealed surface mount packaged devices with full- face bonded chips for low- inductance construction. The MELF ceramic package has square- end terminations, which are ideal for surface mount and pick- and- place operations. The PIN diodes chips are coated with a special hard glass passivation, which is required both for high- power applications and to enhance the reliability, resulting in mean time between failures (MTBFs) of greater than one million hours. These Ro HS- pliant products meet the requirements of EU Directive 2002/95/EC. The standard terminal finish is matte tin unless otherwise specified. Alternative terminal finishes are available. Key Features - Low- magnetic (ideal for MRI applications) - Very low inductance, full- face bonding - High- reliability hermetic design - Surface mount devices available in tape and reel - Ro HS pliant1 - ESD HMB Class 2 Package Styles Applications - Designed for low- loss and low- distortion applications - Switch- filter bank - T/R control - Attenuators - MRI switching Performance Overview Parameter Conditions Value Units IR = 10 μA 500 CT at 50V 0.5- 1.2 p F Rs at 100 m A 0.40- 0.85 Ω Rs at 200 m A 0.2- 0.55 Ω 1.5- 5.5 μs θP 15- 35 °C/W Note:  1. Ro HS versions are supplied with a matte tin finish. Performance Curves Data Sheet © 2023 Microchip Technology Inc. and its subsidiaries DS00005065A - 1 UMX502- UMX812 Table of Contents Product Overview 1. Electrical Specifications 3 1.1. Typical Electrical Performance...