Micron Confidential and Proprietary
8Gb, 16Gb, and 32Gb: x8 NAND Flash Memory
Features
NAND Flash Memory MLC
MT29F8G08MAAWC, MT29F8G08MAAWP,
MT29F16G08QAAWC,MT29F32G08TAAWC
Features
• Organization
– Page size
x8: 2,112 bytes (2,048 + 64 bytes)
Block size: 128 pages (256K + 8K bytes)
– Plane size: 2,048 blocks
– Device size: 8Gb: 4,096 blocks; 16Gb: 8,192 blocks;
32Gb: 16,384 blocks
• READ performance
– Random READ: 50µs
– Sequential READ: 25ns
• WRITE performance
– PROGRAM PAGE: 650µs (TYP)
– BLOCK ERASE: 2ms (TYP)
• Endurance: 10,000 PROGRAM/ERASE cycles
(with ECC and invalid block mapping)
• First block (block address 00h) guaranteed to be
valid with ECC when shipped from factory
• Industry-standard basic NAND Flash command set
• New commands
– PAGE READ CACHE MODE
– TWO-PLANE/MULTIPLE-DIE READ STATUS
– Two-plane commands for concurrent-plane oper-
ations
– READ UNIQUE ID (contact factory)
– READ ID2 (contact factory)
• Operation status byte provides a software method of
detecting:
– PROGRAM/ERASE/READ operation completion
– PROGRAM/ERASE pass/fail condition
– Write-protect status
• Ready/busy# (R/B#) signal provides a hardware
method of detecting PROGRAM, READ, or ERASE
cycle completion
• WP# signal: Entire device hardware write protect
• Staggered power-up sequence: Issue RESET (FFh)
command
Figure 1: 48-Pin TSOP Type 1
Options
• Density1
– 8Gb (single-die stack)
– 16Gb (dual-die stack)
– 32Gb (quad-die stack)
• Device width: x8
• Configuration
# of die # of # of
I/O
CE# R/B#
11
1
Common
22
2
Common
42
2
Common
• VCC: 2.7–3.6V
• First-generation die
• Package
– 48-pin TSOP type I (lead-free plating)
– 48-pin TSOP type I OCPL2 (lead-free plating)
• Operating temperature
– Commercial (0°C to 70°C)
– Extended (–40°C to +85°C)3
Notes: 1. For part numbering and markings, see
Figure 2 on page 2.
2. OCPL = off-center parting line.
3. For ET devices.
MLC PDF: 09005aef828313aa / Source: 09005aef82831392
8gb_nand_l41b_mlc__1.fm - Rev. B 11/07 EN
1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2007 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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