Datasheet4U Logo Datasheet4U.com
Microsemi (now Microchip Technology) logo

LX3050 Datasheet

Manufacturer: Microsemi (now Microchip Technology)

This datasheet includes multiple variants, all published together in a single manufacturer document.

LX3050 datasheet preview

Datasheet Details

Part number LX3050
Datasheet LX3050 LX3051 Datasheet (PDF)
File Size 184.70 KB
Manufacturer Microsemi (now Microchip Technology)
Description InGaAs PIN PHOTODIODE
LX3050 page 2 LX3050 page 3

LX3050 Overview

Microsemi’s InGaAs Coplanar PIN Photodiode chips are ideal for high bandwidth 1310 and 1550 nm single-mode-fiber optical networking applications. The device family offers superior responsivity performance and high bandwidth with large active area in single die and 1x4 array die. The G-S-G coplanar waveguide allows very low cross-talk within the array.

LX3050 Key Features

  • LX3051 single die, 3 Gbs, 80µm active area
  • LX3050 single die, 10 Gbs, 32µm active area
  • LX3052 1x4 array die, 10 Gbs, 32µm active area
  • Coplanar Waveguide, 50 ohm characteristic impedance
  • High Responsivity
  • Low Dark Current
  • High Bandwidth
  • Anode/Cathode on illuminated Side
  • 125µm Pad pitch
  • Die good for bond wire or flip chip
Microsemi (now Microchip Technology) logo - Manufacturer

More Datasheets from Microsemi (now Microchip Technology)

See all Microsemi (now Microchip Technology) datasheets

Part Number Description
LX3051 InGaAs PIN PHOTODIODE
LX3052 InGaAs PIN PHOTODIODE
LX3055 Coplanar InGaAs/InP PIN Photo Diode
LX3301A Inductive Sensor Interface
LX3302 Inductive Sensor Interface

LX3050 Distributor

Datasheet4U Logo
Since 2006. D4U Semicon. About Datasheet4U Contact Us Privacy Policy Purchase of parts