Full PDF Text Transcription for LX3055 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
LX3055. For precise diagrams, and layout, please refer to the original PDF.
WWW.Microsemi .COM Obsolete Product – not recommended for new design LX3055 TM ® Coplanar InGaAs/InP PIN Photo Diode PRODUCTION DATA SHEET DESCRIPTION KEY FEATURES Micros...
View more extracted text
PIN Photo Diode PRODUCTION DATA SHEET DESCRIPTION KEY FEATURES Microsemi’s InGaAs/InP PIN custom assembly configurations LX3055 single die Photo Diode chips are ideal for high including traditional wirebond or flip Coplanar Waveguide , 50Ω bandwidth 1310nm and 1550nm chip assembly High Responsivity optical networking applications. This device is ideal for Low Dark Current The device series offers high manufacturers of optical receivers, responsivity, low dark current, and transponders, optical transmission high bandwidth for high performance modules and combination PIN photo and low sensitivity receiver design. di
More Datasheets from Microsemi (now Microchip Technology)
LX3055 Datasheet
