* Small size for hybrid assembly
* 1,500 Vdc electrical isolation
* Available in package form or ceramic substrate (5) + A (6) (4) C - (1) C Descrip.

NC 4 5 1 6
* MXP1156 - standard TO-18 package. NC Electrical Characteristics @ 25oC SYMBOL Voc Isc VF VR T(on) .

* The MXP1156 series consists of a light emmitting source coupled to a dielectrically isolated photovoltaic diode array. This device can be used to drive MOS devices. Bottom View
* MXP1156H - chip on ceramic substrate for Hybrid applications.

MXP1152

MXP1158

MXP1123

MXP1123HS-C

MXP1126-C

MXP1001-PS

MXP1001-Q

MXP1002PC-IR

MXP1002PV-IR

MXP1004-PS

MXP1004-Q

MXP1007AT

MXP1008AT