MXP1126-C datasheet, chip equivalent, Microsemi

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* Light Activated Photo Transistor Chip Planar NPN Aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic or Epoxy .

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Microsemi (https://www.microsemi.com/)

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MXP1126-C Datasheet, Microsemi

MXP1126-C Datasheet, Microsemi

Features and benefits