MS2208 application equivalent, rf & microwave transistors avionics application.
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* HERMETIC METAL/CERAMIC PACKAGE LOW THERMAL RESISTANCE 10:1 LOAD VSWR CAPABILITY BALLASTED OVERLAY GEOMETRY COMMON EMITTER CONFIGURATION
DES.
INVOLVING HIGH PULSE BURST DUTY CYCLES. THE DEVICE IS CAPABLE OF OPERATION OVER A WIDE RANGE OF PULSE WIDTHS, DUTY CYCLE.
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