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CMA-545 - Monolithic Amplifier

Download the CMA-545 datasheet PDF. This datasheet also covers the CMA-545-Mini variant, as both devices belong to the same monolithic amplifier family and are provided as variant models within a single manufacturer datasheet.

General Description

CMA-545+ is a high dynamic range, low noise, high IP3, high output power, monolithic amplifier.

technology enables it to work with a single positive supply voltage.

Unconditionally stable over the operating frequency.

Key Features

  • Feature Ultra Low Noise: 0.8 dB NF at 1GHz Advantages Industry Leading Noise Figure, measured in a 50 Ohm environment.
  • without any external matching. High IP3: Combining Low Noise and High IP3 makes this MMIC amplifier ideal for Low Noise +35 dBm IP3 at 1GHz Receiver Front End (RFE) because it gives the user advantages at both ends of the dynamic range, sensitivity & high level operation. Output Power: +20 dBm at 1GHz Broad Band: 0.05 to 6.0GHz Internally Matched Ceramic Hermet.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (CMA-545-Mini-Circuits.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number CMA-545
Manufacturer Mini-Circuits
File Size 315.18 KB
Description Monolithic Amplifier
Datasheet download datasheet CMA-545 Datasheet

Full PDF Text Transcription for CMA-545 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for CMA-545. For precise diagrams, and layout, please refer to the original PDF.

MonolithicUltra Low Noise, High IPA3 mplifier 50Ω 0.05 to 6 GHz CMA-545+ The Big Deal • Ceramic, Hermetically sealed, Nitrogen Filled • Low profile case, .045” high • Ult...

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metically sealed, Nitrogen Filled • Low profile case, .045” high • Ultra Low Noise Figure, 0.8 dB typ. • Output Power, +20dBm at 1GHz CASE STYLE: DL1721 Product Overview Mini-Circuits CMA-545+ delivers a unique combination of ultra low noise and high IP3 performance, ideal for sensitive receiver applications. The E-PHEMT amplifier die is bonded to a multilayer integrated LTCC substrate, and then hermetically sealed under a controlled nitrogen atmosphere with gold-plated covers and eutectic AuSn solder. As a result, this rugged amplifier has met MIL requirements for gross leak, fine leak, thermal shock, vibration, accelerat