Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer (） Silicone Resin(with phosphor) + Ag-plated Copper Alloy 0.036g(TYP) A Protection Device 4 SOLDERING NICHIA STS-DA1-2142B .

NESB064T

NESB008AT

NESB146AT-N3

NESB146AT-NA

NESB146AT-ND

NES120

NES1821B-30

NES1823P-100

NES1823P-140

NES1823P-30

NES1823P-45

NES1823P-50

NES240-24