Package Materials Heat-Resistant Polymer Encapsulating Resin Materials (） Silicone Resin(with phosphor) Electrodes Materials Weight + Au-plated Copper Alloy 0.0051g(TYP) * 。 Dimensions do not include mold flash or metal burr. 4 SOLDERIN.

NESB146AT-N3

NESB146AT-NA

NESB008AT

NESB064AT-NA

NESB064T

NES120

NES1821B-30

NES1823P-100

NES1823P-140

NES1823P-30

NES1823P-45

NES1823P-50

NES240-24